Specifications

Ceramic (Boride, Carbide, Fluoride, Oxide, Selenide, Silicide, Sulfides, Tellurides) Sputteirng Targe

Ceramic (Boride, Carbide, Fluoride, Oxide, Selenide, Silicide, Sulfides, Tellurides)Sputteirng Target
There are many engineers working this field over 20 years in China rare metal material Co.,ltd.

Quality is of paramount importance as we match the material to the client's needs and ensure its complete traceability.

CRM pride ourselves on prompt responses steady quality and competitive pricing.

Speciafication:

Purity:99%-99.9999%
Shape: Plate, Sheet, Disk, Rectangle, Tube, Rod and by drawing
Application: Optical thin film, Electric Thin film, Superconducting thin film, Protective film, Surface engineer,...

Molding Method: Vacuum hot-press, HIP furnace, HP furnace, CIP, Vacuum Sinter, Spraying

Machine: Vacuum Casting, AtmosphericCasting, Rolling(hot/cold), Cold Rolling, Forging (hot/cold), Cutting, Milling, Sawing, Grinding, etc.
Dimension: Diameter (<500mm), Length (<1000mm), Width (<500mm), Thickness (>1mm), by drawing

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Authentication

1.1 (Ceramic Sputtering Targets)

1.1.1 (Brittle Elemental Sputtering Target Materials):

B;Bi;Cr;Re;Ru;Sb;Se;Te;

1.1.2 (Oxide Sputtering Targets):

Al2O3;Bi2O3;Cr2O3;CuO;Cu2O;Fe2O3;Fe3O4;HfO2;In2O3;MgO;MoO3;Nb2O5;NbOx;NiO;PbO;Sb2O3;SiO;SiO2;;Ta2O5,TaOx;TiO;TiOx;TiO2:ZrO2;V2O5;WO3;ZnO;ZrO2;

La2O3;CeO2;Nd2O3;Sm2O3;Eu2O3;Gd2O3;Tb4O7;Dy2O3;Ho2O3;Er2O3;Tm2O3;Yb2O3;Lu2O3;Sc2O3;Y2O3;

1.1.3 (Nitride Sputtering Targets):

AlN;BN;HfN;NbN;Si3N4;TaN;TiCN;TiN;VN;ZrN

1.1.4 (Carbide Sputtering Targets):

B4C;Cr3C2;HfC;Mo2C;NbC;SiC;TaC;TiC;VC;W2C;WC;WC+Co;WC+Ni;ZrC

1.1.5 (Fluoride Sputtering Targets):

BaF2;CaF2;CeF3;DyF3;ErF3;HfF4;LaF3;LiF;MgF2;Na3AlF6;NaF;NdF3;PbF2;PrF3;SmF3;YbF3;YF3

1.1.6 (Silicide Sputtering Targets):

CoSi2;CrSi2;HfSi2;MoSi2;NbSi2;NiSi2;TaSi2;TiSi2;VSi2;WSi2;ZrSi2

1.1.7 (Sulfide Sputtering Targets):

As2S3;Bi2S3;CdS;CuS;Cu2S;FeS;FeS2;Ga2S3;GeS;In2S3;MoS2;NbS;PbS;Sb2S3;SnS2;TaS2;WS2;ZnS;

1.1.8 (Boride Sputtering Targets):

CrB2;FeB;HfB2;LaB6;Mo2B;NdB2;TaB2;TiB2;VB2;WB2;ZrB2

1.1.9 (Selenide Sputtering Targets):

As2Se3;Bi2Se3;CdSe;CuSe;CuSe2;Ga2Se3;GeSe;InSe;In2Se3;MoSe2;NbSe2;PbSe;Sb2Se3;TaSe2;WSe2;ZnSe

1.1.10 (Telluride Sputtering Targets):

Ag2Te;Al2Te3;Al2Te3;As2Te3;Bi2Te3;CdTe;CuTe;Cu2Te;GaTe;Ga2Te3;GeTe; In2Te3;MoTe2;NbTe2;PbTe;Sb2Te3;SnTe;TaTe2;TmTe;ZnTe

1.1.11 (Antimonide Sputtering Targets):

Bi2Sb3;GaSb;InSb;In2Sb3;PbSb

1.1.12 (Other High Purity Multi-Compound Sputtering Targets):

AgInS2;AgInTe2;BixSb1-xTe;CdInTe4;CuZnSnS;CIGS(CuInxGa1-xSe2);CIGSS(CuInxGa1-x(Se.S)2);CuInSe2;GaxAl1-xAs;GeSbTe;PbxSn1-xAs;ZnIn2Te4;ZnxCd1-xTe;

1.1.13 (Other Mixture Sputtering Targets):

ATO(Sb2O3:SnO2);AZO(ZnO:Al2O3);GZO(ZnO:Ga2O3);IGZO(In2O3+Ga2O3+ZnO);ITO(In2O3:SnO2);IZO(ZnO:In2O3);YSZ(ZrO2:Y2O3);PZT(PbZrO3-PbTiO3)

BaTiO3;SrTiO3;PbTiO3;PbZrO3;SrZrO3;LaAl2O3;LaNbO3;LiNbO3;LSMO;Li3PO4;

Cr-SiO,ZrO2+SiO2;Al2O3+ZrO2;Al2O3+MgO;CaF2+CeF3;CuO+In2O3;Ta2O5+TiO2;Ta2O5+ ZrO2;TiO2+Nb2O5 ;TiO2+ ZrO2;YAG;YBCO;

1.1.14  Other brittle material that couldn't produce with melting process.